Thermal debonding protective film Manufacturer
Chentao’s heat-release adhesive tapes have good adhesion and are suitable for electronic assembly, laser processing and automated manufacturing, with uniform adhesion, anti-static properties and resistance to solvents or UV exposure. The product supports custom thickness, is UL/ROHS certified, and offers bulk pricing. Request samples now for OEM support.
Thermal debonding protective film Introduction
A specialized bonding solution for temporary fixation in high-precision industries, Thermal Release Tape combines a heat-resistant PET or polyimide film with a controlled-tack silicone or acrylic adhesive. Designed to maintain strong adhesion during processing and release instantly upon heating to 80–150°C, it ensures residue-free removal, protecting delicate surfaces like semiconductor wafers, flexible PCBs, and optical components. Ideal for electronics assembly, laser processing, and automated manufacturing, this tape offers uniform adhesion, anti-static properties, and resistance to solvents or UV exposure. Compliant with IPC, RoHS, and ISO 10993 standards, it enables efficient handling of fragile materials without damage, while its low outgassing performance suits vacuum environments.
Technical Specifications
| CT-RJ114 | ||
|---|---|---|
| Item | Unit | Value |
| Substrate thickness | μm | 100±2 |
| Glue thickness | μm | 60±2 |
| Release film thickness | μm | 50±3 |
| Total thickness | μm | 160±4 |
| Adhesion to the steel plate | g/25mm | 200+ |
| Recommended heat release temperature (for steel sheet) | 130-150℃/2-3min | Complete loss of viscosity |
Note: All the above data are just for reference, all data might change without notices or updates, please contact our sales team to confirm all details Via Whatsapp or Email.
| CT-RJ138 | ||
|---|---|---|
| Item | Unit | Value |
| Substrate thickness | μm | 50±3 |
| Glue thickness | μm | 30±2 |
| Release film thickness | μm | 50±3 |
| Total thickness | μm | 80±5 |
| Adhesion to the steel plate | g/25mm | 600+ |
| Thermal Debonding Test (Oven) | 120℃/5min | Complete loss of viscosity |
| Thermal Debonding Test (Boiling Water) | 100℃/5min | Complete loss of viscosity |
Note: All the above data are just for reference, all data might change without notices or updates, please contact our sales team to confirm all details Via Whatsapp or Email.
| Blue heat release adhesive tape -- CT-RJ160 | ||
|---|---|---|
| Item | Unit | Value |
| Substrate thickness | μm | 100±3 |
| Glue thickness | μm | 30±5 |
| Release film thickness | μm | 50±3 |
| Total thickness | μm | 130±8 |
| Adhesion to the steel plate | g/25mm | 600+ |
| Thermal Debonding Test (Oven) | 150℃/5min | Complete loss of viscosity |
| Thermal Debonding Test (Boiling Water) | 100℃/5min | Complete loss of viscosity |
Note: All the above data are just for reference, all data might change without notices or updates, please contact our sales team to confirm all details Via Whatsapp or Email.
Optional (OEM / Customized)
- Length
- Width
- Core material and diameter
- Shape(die-cutting)
- Package(Printed / OEM)
other Protective Film
Globally accepted, approved by manufacturers and wholesalers
Compliance & Certifications
Contact ChenTao Tapes
Feel free to contact the ChenTao Tapes team via WhatsApp, WeChat, Email, or Phone Calls for any questions you may have,
our well-trained operation team is ready to give you the answers you need.