Copper Foil Tape for EMI Shielding and Grounding
ChenTao copper foil tape combines soft copper foil with conductive or non-conductive PSA for EMI shielding, static drainage and grounding. Typical thickness runs 0.05-0.15 mm, MOQ starts from 50 rolls, and samples can be prepared in 24 hours from an ISO 9001 / 14001 / 45001 facility.
Copper Foil Tape Built for Conductive Paths
A thin copper carrier gives the tape high conformability, solderable surface options and stable shielding performance in compact electronic assemblies.
Copper foil tape is a pressure-sensitive adhesive tape that uses copper foil as the carrier. It is commonly specified where designers need a conductive surface, EMI shielding layer, grounding path, static drainage strip or repair patch inside electronic equipment.
ChenTao supplies both conductive adhesive and non-conductive PSA versions. Conductive adhesive helps current pass through the adhesive layer, while non-conductive PSA is used when the copper surface itself provides the required shield or contact path.
ChenTao manufacturing fit
The product is suited for OEM buyers who need repeatable width, clean edge slitting, optional release liner, custom die-cutting and batch documentation rather than only catalogue roll sizes.
Where Copper Foil Tape Is Typically Used
Four common engineering use cases for shielding, grounding and conductive assembly work.
EMI Shielding
Applied inside housings, displays and modules to reduce electromagnetic interference between sensitive components.
Cable & Harness Grounding
Wraps, bonds and bridges shield layers in cables, wire harnesses and conductive assemblies.
PCB Trace Repair
Supports prototyping, shielding patches and conductive repair work where solderable copper surfaces are required.
Static Drainage
Used as a conductive path or shielding layer in motor, battery and electronics sub-assemblies.
Typical Technical Data
Use these values for initial material screening. Final specifications should be confirmed against your drawing, adhesive system and test conditions.
| Property | Test Method | Unit | Value |
|---|---|---|---|
| Carrier material | Visual / COA | - | Copper foil |
| Total thickness | ASTM D3652 | mm | 0.05-0.15 |
| Reference construction | ASTM D3652 | um | 35 um copper foil + 30 um adhesive, project dependent |
| Service temperature | IEC 60454 | C | -20 to 120 typical |
| Peel adhesion to steel | ASTM D3330 | N/25 mm | 9.7 minimum reference |
| Tensile strength | ASTM D3759 | N/25 mm | 110 reference |
| Elongation at break | ASTM D3759 | % | 4 reference |
| Through-adhesive resistance | ASTM D257 | ohm/sq in | 0.05 or lower reference, conductive adhesive grade |
| Shielding effectiveness | ASTM D4935 | dB | 55-80 reference range |
| Roll width | ASTM D3652 | mm | 3-500 custom slitting |
| Roll length | ASTM D3652 | m | 25 / 50 standard; custom by project |
| Release liner | Visual | - | Available on request for die-cutting and placement |
Values are typical, not specification limits. Data should be validated under actual temperature, pressure, dwell time and substrate conditions.
Copper Foil Tape vs Alternative Materials
Choose the material by conductivity, formability, dielectric need and assembly workflow.
| Factor | ChenTao Copper Foil Tape | Aluminum Foil Tape | Conductive Fabric Tape | Polyimide Tape |
|---|---|---|---|---|
| Max temp | 120 C typical | 120 C typical | 80-120 C typical | 180 C continuous class |
| Electrical role | Conductive shielding and grounding | Shielding, vapor barrier, thermal reflection | Flexible EMI gasket and wrap | Electrical insulation |
| Conformability | High on flat and curved parts | Medium; wrinkles more easily | Very high on irregular shapes | High, but not conductive |
| Hand-tearable | No, cut recommended | No, cut recommended | Often yes by grade | No, cut recommended |
| Relative cost | $$ | $ | $$$ | $$ |
| Best fit | EMI shielding, grounding, PCB repair | HVAC foil seams and shielding layers | Flexible enclosure gaskets and cable wraps | High-temperature masking and insulation |
Customization Options
Share your target resistance, width, roll format, liner and substrate so ChenTao can match the tape to your assembly process.
Width, Length & Slit Tolerance
Conductivity & Handling
Private Label & Logistics
Engineering Scenario - EMI Shielding in Electronics Assembly
A typical specification framework for using copper foil tape inside electronic housings and modules.
How ChenTao copper foil tape is specified into shielding assemblies
Engineers usually need a thin conductive layer that bonds to housings, covers seams, drains static and maintains electrical contact without adding bulky metal parts.
ChenTao matches foil thickness, adhesive conductivity, liner choice and slit width to the assembly process. For repeat production, die-cut shapes and batch QA reports help keep placement and electrical checks consistent.
Samples, quotation and documentation are organized to help engineers move from shielding trials to repeat purchasing with fewer specification gaps.
Certifications & Material Compliance
Click any card to request the document package. ChenTao will email the requested file set within 24 hours.
Frequently Asked Questions
Ready to spec ChenTao Copper Foil Tape into your design?
20+ year ISO 9001 / 14001 / 45001 manufacturer / Sample in 24 hours / Quote in 12 hours. Send your shielding requirement and we will respond with a practical specification proposal.