UV Viscosity Reducing Film Manufacturer

UV tape is specially designed for positioning and cutting tapes in the process of SMD electronic components, SMT component tapes, MLCC chip capacitor tapes, and chip inductor; semiconductor chip surface processing tapes; electronic and optoelectronic industry component manufacturing and processing engineering tapes; LCD and TP touch panel glass thinning, grinding and polishing tapes; LED cutting grinding and polishing tapes; sapphire substrate thinning and grinding process tapes; wafer grinding, cutting, various silicon wafers, packaging substrates, ceramics, glass, crystal fine electronic parts bearing processing and various materials of small parts processing and cutting. Coated with special adhesive, with high adhesion, it can stick to the chip with super strong adhesion during cutting, even small chips will not be displaced or peeled off, so that the chip will not fall off or fly away during the grinding and cutting process, prevent edge collapse, and can be cut accurately without expansion, ensuring processing quality. After processing, the adhesion can be instantly reduced by irradiating with an appropriate amount of ultraviolet light. Even large chips can be easily and correctly picked up without residual adhesive or contamination. The pick-up performance is improved when picking up the chip. There is no contamination caused by adhesive contamination, and there will be no adverse effects on the IC due to ultraviolet radiation.